Popis produktu
- Thermal compund (grease) for heatsinks
- Helps the heat dissipation from a CPU, chipset or processor to a heatsink
- Excellent thermal impedance
- Perfect stability - will not separate, run, migrate, or bleed
- Non capacitive or electrically conductive
| Weight: 1.5 g |
| Color: grey |
| Thermal conductivity: > 4.5 W / mK |
| Thermal Impedance <0.205 ° C-in2 / W |
| Density: > 2.5 |
| Evaporation: <0.001 % |
| Volatility: <0.005 % |
| The dielectric constant: > 5.1 |
| Dissipation Factor: <0.005 |
| Viscosity: 76 CPS |
| Thixotropic index: 310 ± 10 ° C |
| Operating Temperature: -50 ~ 240 ° C |
| Composites: 50% silicone compounds |
| Compounds: 30% of carbon |
| The compounds of metal oxides: 20% |
Parametry
Diskuse
Typ příslušenství:
Termální pasty
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