Popis produktu
- Thermal silicone pad for heatsinks
- Helps the heat dissipation from a CPU, chipset or processor to a heatsink
- Excellent thermal impedance
- Perfect stability - will not separate, run, migrate, or bleed
- Non capacitive or electrically conductive
| Dimensions: 100 x 100 x 1 mm |
| Net weight: 23 g |
| Color: grey |
| Thermal conductivity: 2.0 W/m-K |
| Specific gravity: 1.7 +0.1 g/cm3 |
| Hardness: 40 ± 5 Shore C |
| Continuous use temp: -40 ... +250 ? |
| Dielectric breakdown voltage: ?3-5 KV |
| Dielectric constant: ?4.5 - 5.5 1M Hz |
| Volume resistivity: >4.0 x 1011 ?.cm |
| Flame rating: V-0 |
| Thermal impedance: 0.18 ... 0.25 ?-in2/W |
Parametry
Diskuse
Typ příslušenství:
Ostatní
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